Achieving high-efficiency and low-damage processing of SiC and GaN substrates (CARE device)
A next-generation semiconductor substrate flattening processing device that achieves both cost reduction and high quality for power semiconductor substrates! Realizing high-precision flattening processing while minimizing environmental impact.
The flatness processing device "CARE-TEC," developed by Toho Koki Co., Ltd., for next-generation semiconductor substrates, utilizes a new processing method that leverages catalytic action to efficiently and low-damage process high-hardness materials, including SiC (silicon carbide). *This is a product under development.* It suppresses processing damage and the occurrence of scratches, which have been challenges in conventional mechanical polishing, achieving excellent flatness and surface quality. It also contributes to cost reduction through shorter processing times and reduced usage of consumables. In addition to improving the efficiency of the processing steps, it also contributes to reducing environmental impact and manufacturing costs, accommodating a wide range of applications from research and development to mass production processes for next-generation power semiconductors. As a new flattening processing technology that realizes high quality, high productivity, and low cost, it supports productivity improvements in semiconductor manufacturing sites.
- Company：東邦エンジニアリング
- Price：Other
